Fabrication Technologies for Three-Dimensional Integrated Circuits (invited). - Rafael Reif; Andy Fan; Kuan-Neng Chen; Shamik Das (ISQED, 2002)

Technology, performance, and computer-aided design of three-dimensional integrated circuits. - Shamik Das; Andy Fan; Kuan-Neng Chen; Chuan Seng Tan; Nisha Checka; Rafael Reif (ISPD, 2004)

Three dimensional integration technology using copper wafer bonding. - Andy Fan (2006)

Sample concentration and purification for point-of-care diagnostics. - Nga T. Ho; Andy Fan; Catherine M. Klapperich; Mario Cabodi (EMBC, 2012)