Generating Functions for Actions on Handlebodies with Genus Zero Quotient. - Matt Compton; Andy Miller (J. Comb. Theory A, 1999)

Counting numerical sets with no small atoms. - Jeremy Louis Marzuola; Andy Miller (J. Comb. Theory A, 2010)

In-line metrology and inspection for process control during 3D stacking of IC's. - Sandip Halder; Ingrid De Wolf; Alain Phommahaxay; Andy Miller; Mireille Maenhoudt; Gerald Beyer; Bart Swinnen; Eric Beyne (3DIC, 2011)

Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding. - Alain Phommahaxay; Anne Jourdain; Greet Verbinnen; Tobias Woitke; Peter Bisson; Markus Gabriel; Walter Spiess; Alice Guerrero; Jeremy McCutcheon; Rama Puligadda; Pieter Bex; Axel Van den Eede; et al. (3DIC, 2011)

Trees of integral triangles with given rectangular defect. - Andy Miller (Discret. Math., 2013)

Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics. - Soon-Wook Kim; Lan Peng; Andy Miller; Gerald Beyer; Eric Beyne; Chung-Sun Lee (3DIC, 2015)

Processing active devices on Si interposer and impact on cost. - Dimitrios Velenis; Mikael Detalle; Geert Hellings; Mirko Scholz; Erik Jan Marinissen; Geert Van der Plas; Antonio La Manna; Andy Miller; Dimitri Linten; Eric Beyne (3DIC, 2015)

Die to wafer 3D stacking for below 10um pitch microbumps. - Jaber Derakhshandeh; Lin Hou; Inge De Preter; Carine Gerets; Samuel Suhard; Vikas Dubey; Geraldine Jamieson; Fumihiro Inoue; Tomas Webers; Pieter Bex; Giovanni Capuz; Eric Beyne; et al. (3DIC, 2016)

Extreme wafer thinning optimization for via-last applications. - Anne Jourdain; Joeri De Vos; Fumihiro Inoue; Kenneth J. Rebibis; Andy Miller; Gerald Beyer; Eric Beyne; Edward Walsby; Jash Patel; Oliver Ansell; Janet Hopkins; Huma Ashraf; et al. (3DIC, 2016)

Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects. - Joeri De Vos; Lan Peng; Alain Phommahaxay; Joost Van Ongeval; Andy Miller; Eric Beyne; Florian Kurz; Thomas Wagenleiter; Markus Wimplinger; Thomas Uhrmann (3DIC, 2016)

Silicon Photonics for 56G NRZ Optical Interconnects. - Joris Van Campenhout; Yoojin Ban; Peter De Heyn; Ashwyn Srinivasan; Jeroen De Coster; Sebastien Lardenois; Brad Snyder; Sadhishkumar Balakrishnan; Guy Lepage; Negin Golshani; Sofie Janssen; Alicja Lesniewska; et al. (OFC, 2018)

Packaging and Assembly Challenges for 50G Silicon Photonics Interposers. - Bradley Snyder; Nivesh Mangal; Guy Lepage; Sadhishkumar Balakrishnan; Xiao Sun; Nicolas Pantano; Michal Rakowski; Lieve Bogaerts; Peter De Heyn; Peter Verheyen; Andy Miller; Marianna Pantouvaki; et al. (OFC, 2018)

Process Complexity and Cost Considerations of Multi-Layer Die Stacks. - Dimitrios Velenis; Joeri De Vos; Soon-Wook Kim; Jaber Derakhshandeh; Pieter Bex; Giovanni Capuz; Samuel Suhard; Kenneth June Rebibis; Stefaan Van Huylenbroeck; Erik Jan Marinissen; Alain Phommahaxay; Andy Miller; et al. (3DIC, 2019)

(Why do we need) Wireless Heterogeneous Integration (anyway?). - Michaël Peeters; S. Sinha; Xiao Sun; Claude Desset; Giuseppe Gramegna; John Slabbekoorn; Pieter Bex; Nelson Pinho; Tomas Webers; Dimitrios Velenis; Andy Miller; Nadine Collaert; et al. (VLSI Technology and Circuits, 2022)

Process Development for a Novel Low Loss and Non-PFAS Photo Imageable Dielectric for RF Silicon Interposer Applications. - Hamideh Jafarpoorchekab; Xiao Sun; Angel Uruena; Siddhartha Sinha; Nelson Pinho; Andy Miller; Nadine Collaert (3DIC, 2024)

Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer. - Pengfei Xu; Junwen He; Koen Kennes; Anton Dvoretskii; Arnita Podpod; Guy Lepage; Negin Golshani; Rafal Magdziak; Swetanshu Bipul; Dieter Bode; Peter Verheyen; Maumita Chakrabarti; et al. (OFC, 2024)

Low-loss, multi-reticle stitched SiN waveguides for 300mm wafer-level optical interconnects. - Pengfei Xu; Chiara Marchese; Guy Lepage; Negin Golshani; Ruben Van Eenaeme; Andrea Mingardi; Joost Van Ongeval; Rafal Magdziak; Luc Halipre; Darko Trivkovic; Peter Verheyen; Maumita Chakrabarti; et al. (OFC, 2024)

Do LLMs "know" internally when they follow instructions? - Juyeon Heo; Christina Heinze-Deml; Oussama Elachqar; Shirley You Ren; Udhay Nallasamy; Andy Miller; Kwan Ho Ryan Chan; Jaya Narain (CoRR, 2024)