A Case Study on IEEE 1838 Compliant Multi-Die 3DIC DFT Implementation. - Anshuman Chandra; Moiz Khan; Ankita Patidar; Fumiaki Takashima; Sandeep Kumar Goel; Bharath Shankaranarayanan; Vuong Nguyen; Vistrita Tyagi; Manish Arora (ITC, 2023)

Scan Design Using Unsupervised Machine Learning to Reduce Functional Timing and Area Impact. - Sandeep Kumar Goel; Ankita Patidar; Frank Lee 004 (ETS, 2024)

Handling Die-to-Die I/O Pads for 3DIC Interconnect Tests. - Sandeep Kumar Goel; Moiz Khan; Ankita Patidar; Frank Lee 004; Vuong Nguyen; Bharath Shankaranarayanan; Doo Kim; Manish Arora (ITC, 2024)

Physical-Aware Interconnect Test for Multi-Die Systems Using 3Dblox Open Standard. - Sandeep Kumar Goel; Ankita Patidar; Moiz Khan; Frank Lee 004; Anshuman Chandra; Martin Keim; Naim Lemar; Jonathan Gaudet; Quoc Phan; Vidya Neerkundar (ITC, 2024)