Creep as a reliability problem in MEMS. - Robert Modlinski; Ann Witvrouw; Petar Ratchev; Anne Jourdain; Veerle Simons; H. A. C. Tilmans; Jaap M. J. den Toonder; Robert Puers; Ingrid De Wolf (Microelectron. Reliab., 2004)

CMOS-MEMS integration: why, how and what? - Ann Witvrouw (ICCAD, 2006)

A Generic Surface Micromachining Module for Mems Hermetic Packaging at Temperatures Below 200 degrees C - Raquel Hellin-Rico; Jean Pierre Celis; Kris Baert; Chris Van Hoof; Ann Witvrouw (CoRR, 2007)

Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS. - Bo Wang; Shuji Tanaka; B. Guo; G. Vereecke; Simone Severi; Ann Witvrouw; Martine Wevers; Ingrid De Wolf (Microelectron. Reliab., 2011)

Effect of the functionalization process on the performance of SiGe MEM resonators used for bio-molecular sensing. - Ahmad Khaled; Moatassim Raoof; Vladimir Cherman; Karoline Jans; Mohammad Abbas; Shaker Ebrahim; Goerge Bryce; Peter Verheyen; Ann Witvrouw; Ingrid De Wolf (Microelectron. Reliab., 2012)

Study of glass frit induced stiction using a micromirror array. - Fangzhou Ling; Jeroen De Coster; Ann Witvrouw; Jean-Pierre Celis; Ingrid De Wolf (Microelectron. Reliab., 2012)

MEMS packaging and reliability: An undividable couple. - Harrie A. C. Tilmans; Jeroen De Coster; Philippe Hélin; Vladimir Cherman; Anne Jourdain; Piet De Moor; Bart Vandevelde; Nga P. Pham; Joseph Zekry; Ann Witvrouw; Ingrid De Wolf (Microelectron. Reliab., 2012)