Early Addressing IC and Package Relationship Allows an Overall Better Quality of Complex SOC. - Anna Fontanelli; Luigi Arnone; Roberto Branca; Giorgio Mastrorocco (ISQED, 2000)

System-on-chip (SoC) requires IC and package co-design and co-verification. - Anna Fontanelli; Stefano Arrigoni; Davide Raccagni; Massimo Rosin (CICC, 2002)

An EDA Perspective, "We Need it Yesterday! - Anna Fontanelli (ISQED, 2003)

System-in-Package Technology: Opportunities and Challenges. - Anna Fontanelli (ISQED, 2008)

Panel: "will 3D-IC remain a technology of the future... even in the future?". - Marco Casale-Rossi; Patrick Leduc; Giovanni De Micheli; Patrick Blouet; Brendan Farley; Anna Fontanelli; Dragomir Milojevic; Steve Smith (DATE, 2013)

NimbleAI: Towards Neuromorphic Sensing-Processing 3D-integrated Chips. - Xabier Iturbe; Nassim Abderrahmane; Jaume Abella 001; Sergi Alcaide; Eric Beyne; Henri-Pierre Charles; Christelle Charpin-Nicolle; Lars Chittka; Angélica Dávila; Arne Erdmann; Carles Estrada; Ander Fernández; et al. (DATE, 2023)