Thermal Scaffolding for Ultra-Dense 3D Integrated Circuits. - Dennis Rich; Anna Kasperovich; Mohamadali Malakoutian; Robert M. Radway; Shiho Hagiwara; Takahide Yoshikawa; Srabanti Chowdhury; Subhasish Mitra (DAC, 2023)

Integration and Characterization of High Thermal Conductivity Materials for Heat Dissipation in Stacked Devices. - W.-Y. Woon; J.-H. Jhang; K.-K. Hu; C.-C. Shih; J.-F. Hsu; J.-P. Lin; Y. Wu; Anna Kasperovich; Mohamadali Malakoutian; Rohith Soman; J. Kim; H.-K. Wei; et al. (VLSI Technology and Circuits, 2024)