Failure mechanisms of adhesive flip chip joints. - Anne Seppälä; T. Allinniemi; Eero Ristolainen (Microelectron. Reliab., 2002)

Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates. - Laura Frisk; Anne Seppälä; Eero Ristolainen (Microelectron. Reliab., 2004)

Study of adhesive flip chip bonding process and failure mechanisms of ACA joints. - Anne Seppälä; Eero Ristolainen (Microelectron. Reliab., 2004)