Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs. - Mohamed Naeim; Hanqi Yang; Pinhong Chen; Rong Bao; Antoine Dekeyser; Giuliano Sisto; Moritz Brunion; Rongmei Chen; Geert Van der Plas; Eric Beyne; Dragomir Milojevic (3DIC, 2023)