Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer. - Pengfei Xu; Junwen He; Koen Kennes; Anton Dvoretskii; Arnita Podpod; Guy Lepage; Negin Golshani; Rafal Magdziak; Swetanshu Bipul; Dieter Bode; Peter Verheyen; Maumita Chakrabarti; et al. (OFC, 2024)