In-tier diagnosis of power domains in 3D TSV ICs. - Yuuki Araga; Makoto Nagata; Geert Van der Plas; Jaemin Kim; Nikolaos Minas; Pol Marchal; Youssef Travaly; Michael Libois; Antonio La Manna; Wenqi Zhang; Eric Beyne (3DIC, 2011)

3D stacking using Cu-Cu direct bonding. - Y. H. Hu; C. S. Liu; M. J. Lii; Kenneth J. Rebibis; Anne Jourdain; Antonio La Manna; Gerald Beyer; Eric Beyne; C. H. Yu (3DIC, 2011)

Analysis of microbump induced stress effects in 3D stacked IC technologies. - Andrej Ivankovic; Geert Van der Plas; V. Moroz; M. Choi; Vladimir Cherman; Abdelkarim Mercha; Paul Marchal; Marcel Gonzalez; Geert Eneman; Wenqi Zhang; Thibault Buisson; Mikael Detalle; et al. (3DIC, 2011)

3D stacking using ultra thin dies. - Antonio La Manna; Dimitrios Velenis; Thibault Buisson; Mikael Detalle; Kenneth J. Rebibis; Wenqi Zhang; Eric Beyne (3DIC, 2011)

3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. - Wei Guo; Geert Van der Plas; Andrej Ivankovic; Geert Eneman; Vladimir Cherman; Bart De Wachter; Abdelkarim Mercha; Mario Gonzalez; Yann Civale; Augusto Redolfi; Thibault Buisson; A. Jourdan; et al. (ICICDT, 2012)

Processing active devices on Si interposer and impact on cost. - Dimitrios Velenis; Mikael Detalle; Geert Hellings; Mirko Scholz; Erik Jan Marinissen; Geert Van der Plas; Antonio La Manna; Andy Miller; Dimitri Linten; Eric Beyne (3DIC, 2015)

Active-lite interposer for 2.5 & 3D integration. - Geert Hellings; Mirko Scholz; Mikael Detalle; Dimitrios Velenis; Muriel de Potter de ten Broeck; C. Roda Neve; Y. Li; Stefaan Van Huylenbroeck; Shih-Hung Chen; Erik Jan Marinissen; Antonio La Manna; Geert Van der Plas; et al. (VLSIC, 2015)