S-Parameters Characterization of Through, Blind, and Buried Via Holes. - Giulio Antonini; Antonio Ciccomancini Scogna; Antonio Orlandi (IEEE Trans. Mob. Comput., 2003)

Electromagnetic Compatibility Issues in Mobile Computing. - Antonio Orlandi; James L. Drewniak (IEEE Trans. Mob. Comput., 2003)

Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology. - Tzong-Lin Wu; Jun Fan 001; Francesco de Paulis; Chuen-De Wang; Antonio Ciccomancini Scogna; Antonio Orlandi (IEICE Trans. Commun., 2010)

General regression neural network approach to prediction of electric field level in the reverberation chamber. - Muhammet Hilmi Nisanci; Yavuz Cengiz; Övünç Polat; Antonio Orlandi; Alistair Duffy (Int. J. Reason. based Intell. Syst., 2010)

The prediction of the electric field level in the reverberation chamber depending on position of stirrer. - Muhammet Hilmi Nisanci; Ecir U. Küçüksille; Yavuz Cengiz; Antonio Orlandi; Alistair Duffy (Expert Syst. Appl., 2011)

Non-Destructive Testing in Complexes Cabling Networks using Time Domain Reflectometry and Particle Swarm Optimization. - Hamza Boudjefdjouf; Rabia Mehasni; Houssem Bouchekara; Antonio Orlandi; Francesco de Paulis (FedCSIS (Position Papers), 2014)

Detectability of Degraded Joint Discontinuities in HV Power Lines Through TDR-Like Remote Monitoring. - Francesco de Paulis; Carlo Olivieri; Antonio Orlandi; Giorgio Giannuzzi (IEEE Trans. Instrum. Meas., 2016)

TEM-Like Launch Geometries and Simplified De-embedding for Accurate Through Silicon Via Characterization. - Francesco de Paulis; Stefano Piersanti; Qian Wang; Jonghyun Cho; Nicholas Erickson; Brice Achkir; Jun Fan 001; James L. Drewniak; Antonio Orlandi (IEEE Trans. Instrum. Meas., 2017)