Effect of pad surface finish and reflow cooling rate on the microstructure and the mechanical behavior of SnAgCu solder alloys. - Sri Chaitra Chavali; Yuvraj Singh; Ganesh Subbarayan; Anurag Bansal; Mudasir Ahmad (Microelectron. Reliab., 2013)

Atrous Space Bender U-Net (ASBU-Net/LogiNet). - Anurag Bansal; Oleg Ostap; Miguel Maestre Trueba; Kristopher Perry (CoRR, 2022)