Closed-form network representations of frequency-dependent RLGC parameters. - A. Ege Engin; Wolfgang Mathis; Werner John; Grit Sommer; Herbert Reichl (Int. J. Circuit Theory Appl., 2005)

3D stacked power distribution considering substrate coupling. - Amirali Shayan Arani; Xiang Hu; Wanping Zhang; Chung-Kuan Cheng; A. Ege Engin; Xiaoming Chen; Mikhail Popovich (ICCD, 2009)

On the bound of time-domain power supply noise based on frequency-domain target impedance. - Xiang Hu; Wenbo Zhao 001; Peng Du; Yulei Zhang 002; Amirali Shayan Arani; Christopher Pan; A. Ege Engin; Chung-Kuan Cheng (SLIP, 2009)

Prediction of high-performance on-chip global interconnection. - Yulei Zhang 002; Xiang Hu; Alina Deutsch; A. Ege Engin; James F. Buckwalter; Chung-Kuan Cheng (SLIP, 2009)

Predicting the worst-case voltage violation in a 3D power network. - Wanping Zhang; Wenjian Yu; Xiang Hu; Amirali Shayan Arani; A. Ege Engin; Chung-Kuan Cheng (SLIP, 2009)

On-chip power network optimization with decoupling capacitors and controlled-ESRs. - Wanping Zhang; Ling Zhang; Amirali Shayan Arani; Wenjian Yu; Xiang Hu; Zhi Zhu; A. Ege Engin; Chung-Kuan Cheng (ASP-DAC, 2010)

Worst-case noise prediction with non-zero current transition times for early power distribution system verification. - Peng Du; Xiang Hu; Shih-Hung Weng; Amirali Shayan Arani; Xiaoming Chen; A. Ege Engin; Chung-Kuan Cheng (ISQED, 2010)

Metal semiconductor (MES) TSVs in 3D ICs: Electrical modeling and design. - A. Ege Engin; N. Srinidhi Raghavan (3DIC, 2011)

Prediction and Comparison of High-Performance On-Chip Global Interconnection. - Yulei Zhang 002; Xiang Hu; Alina Deutsch; A. Ege Engin; James F. Buckwalter; Chung-Kuan Cheng (IEEE Trans. Very Large Scale Integr. Syst., 2011)

Equivalent circuit model extraction for interconnects in 3D ICs. - A. Ege Engin (ASP-DAC, 2013)

Orthogonal rational approximation of transfer functions for high-frequency circuits. - Andrew Ma; Arif Ege Engin (Int. J. Circuit Theory Appl., 2023)