Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures. - Arijit Roy 001; Cher Ming Tan; Rakesh Kumar; Xian Tong Chen (Microelectron. Reliab., 2005)

Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects. - Cher Ming Tan; Arijit Roy 001; Kok Tong Tan; Derek Sim Kwang Ye; Frankie Low (Microelectron. Reliab., 2005)

Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect. - Arijit Roy 001; Cher Ming Tan (Microelectron. Reliab., 2006)

Room temperature observation of point defect on gold surface using thermovoltage mapping. - Arijit Roy 001; Cher Ming Tan; Sean J. O'Shea; Kedar Hippalgaonkar; Wulf Hofbauer (Microelectron. Reliab., 2007)

Electromigration in width transition copper interconnect. - Arijit Roy 001; Yuejin Hou; Cher Ming Tan (Microelectron. Reliab., 2009)

Multiple data access via a common cavity bus in circuit QED. - Dibyendu Chatterjee; Arijit Roy 001 (Int. J. Circuit Theory Appl., 2017)