Technologies for 3D Heterogeneous Integration - Jürgen Wolf; Peter Ramm; Armin Klumpp; Herbert Reichl (CoRR, 2008)

Application of the SLID-ICV interconnection technology for the ATLAS pixel upgrade at SLHC. - Ladislav Andricek; Michael Beimforde; Armin Klumpp; Anna Macchiolo; Karl-Reinhard Merkel; Hans-Günther Moser; Richard Nisius; Rainer Helmut Richter; Josef Weber; Philipp Weigell; Robert Wieland (3DIC, 2010)

High performance 3D interconnects based on electrochemical etch and liquid metal fill. - Harry Hedler; Thomas Scheiter; Markus Schieber; Armin Klumpp; Peter Ramm (3DIC, 2010)

3D-integration of silicon devices: A key technology for sophisticated products. - Armin Klumpp; Peter Ramm; Robert Wieland (DATE, 2010)

3D Integration technology: Status and application development. - Peter Ramm; Armin Klumpp; Josef Weber; Nicolas Lietaer; Maaike Taklo; Walter De Raedt; Thomas Fritzsch; Pascal Couderc (ESSCIRC, 2010)

3D TSV based high frequency components for RF IC and RF MEMS applications. - Montserrat Fernandez-Bolaños; Wolfgang A. Vitale; Mariazel Maqueda Lopez; Adrian M. Ionescu; Armin Klumpp; Karl-Reinhard Merkel; Josef Weber; Peter Ramm; Ilja Ocket; Walter De Raedt; Amin Enayati (3DIC, 2016)

Smart capacitive CO2 sensor. - Jamila Boudaden; Armin Klumpp; Ignaz Eisele; Christoph Kutter (IEEE SENSORS, 2016)

Photoelectrochemical nitrate sensor utilizing Cu/Pd nanoparticles on TiO2-nanoparticles carrier: Combination of catalytic and photocatalytic mechanism. - Rita Siris; Jamila Boudaden; Armin Klumpp (IEEE SENSORS, 2017)

Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration. - Peter Ramm; Armin Klumpp; Christof Landesberger; Josef Weber; Andy Heinig; Peter Schneider; Günter Elst; Manfred Engelhardt (3DIC, 2019)

A CMOS-Based Electrochemical DNA Hybridization Microarray for Diagnostic Applications with 109 Test Sites. - Norman Dodel; Roland Thewes; Anouar Laifi; Dirk Eberhardt; Stefan Keil; Leonhard Sturm; Armin Klumpp; Oliver Freudenberg; Friedel Gerfers; Gerhard Hartwich (BioCAS, 2019)

Superconducting Titanium Nitride in Through-Silicon Vias for 3D Integration of Qubits. - Alexandra Schewski; Ulrich Schaber; Armin Klumpp (3DIC, 2024)