Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration. - Sylvain Joblot; Alexis Farcy; Nicolas Hotellier; Amadine Jouve; François de Crecy; Arnaud Garnier; M. Argoud; C. Ferrandon; J.-P. Colonna; R. Franiatte; C. Laviron; Séverine Cheramy (3DIC, 2013)

Contact-based navigation for an autonomous flying robot. - Adrien Briod; Przemyslaw Kornatowski; Adam Klaptocz; Arnaud Garnier; Marco Pagnamenta; Jean-Christophe Zufferey; Dario Floreano (IROS, 2013)

Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement. - Amadine Jouve; Y. Sinquin; Arnaud Garnier; M. Daval; Pascal Chausse; M. Argoud; N. Allouti; Laurence Baud; Jérôme Dechamp; R. Franiatte; Séverine Cheramy; H. Kato; et al. (3DIC, 2015)

3D advanced integration technology for heterogeneous systems. - Pascal Vivet; Christian Bernard; Fabien Clermidy; Denis Dutoit; Eric Guthmuller; Ivan Miro Panades; Gaël Pillonnet; Yvain Thonnart; Arnaud Garnier; Didier Lattard; Amandine Jouve; Franck Bana; et al. (3DIC, 2015)

Development and evaluation of a portable MR compatible haptic interface for human motor control. - Ildar Farkhatdinov; Arnaud Garnier; Etienne Burdet (World Haptics, 2015)

ITAC: A complete 3D integration test platform. - Didier Lattard; Lucile Arnaud; Arnaud Garnier; Nicolas Bresson; Franck Bana; R. Segaud; Amadine Jouve; H. Jacquinot; Stéphane Moreau; Karim Azizi-Mourier; C. Chantre; Pascal Vivet; et al. (3DIC, 2016)

2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet Interconnects and 156mW/mm2@ 82%-Peak-Efficiency DC-DC Converters. - Pascal Vivet; Eric Guthmuller; Yvain Thonnart; Gaël Pillonnet; Guillaume Moritz; Ivan Miro-Panades; César Fuguet Tortolero; Jean Durupt; Christian Bernard; Didier Varreau; Julian J. H. Pontes; Sébastien Thuries; et al. (ISSCC, 2020)

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management. - Pascal Vivet; Eric Guthmuller; Yvain Thonnart; Gaël Pillonnet; César Fuguet Tortolero; Ivan Miro-Panades; Guillaume Moritz; Jean Durupt; Christian Bernard; Didier Varreau; Julian J. H. Pontes; Sébastien Thuries; et al. (IEEE J. Solid State Circuits, 2021)

Evaluation of a Portable fMRI Compatible Robotic Wrist Interface. - Ildar Farkhatdinov; Arnaud Garnier; Tomoki Arichi; Hannes Bleuler; Etienne Burdet (EMBC, 2022)