Solutions to Multiple Probing Challenges for Test Access to Multi-Die Stacked Integrated Circuits. - Erik Jan Marinissen; Ferenc Fodor; Arnita Podpod; Michele Stucchi; Yu-Rong Jian; Cheng-Wen Wu (ITC, 2018)

Sub-1 dB Loss SiN-to-Polymer Waveguide Coupling: an Enabler for Co-Packaged Optics. - Jef Van Asch; Jeroen Missinne; Junwen He; Pengfei Xu; Arnita Podpod; Guy Lepage; Negin Golshani; Rafal Magdziak; Huseyin Sar; Hakim Kobbi; Swetanshu Bipul; Dieter Bode; et al. (OFC, 2024)

Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer. - Pengfei Xu; Junwen He; Koen Kennes; Anton Dvoretskii; Arnita Podpod; Guy Lepage; Negin Golshani; Rafal Magdziak; Swetanshu Bipul; Dieter Bode; Peter Verheyen; Maumita Chakrabarti; et al. (OFC, 2024)