Numerical approach to characterization of thermally conductive adhesives. - Tomasz Falat; Artur Wymyslowski; Jana Kolbe (Microelectron. Reliab., 2007)

Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach. - Tomasz Falat; Artur Wymyslowski; Jana Kolbe; Kaspar M. B. Jansen; Leo J. Ernst (Microelectron. Reliab., 2007)

Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. - Artur Wymyslowski (Microelectron. Reliab., 2007)

Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability. - Artur Wymyslowski; W. D. van Driel; J. van de Peer; N. Tzannetakis; G. Q. Zhang (Microelectron. Reliab., 2007)

Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. - Artur Wymyslowski; Bart Vandevelde; Dag Andersson (Microelectron. Reliab., 2007)

An approach of numerical multi-objective optimization in stacked packaging. - Lukasz Dowhan; Artur Wymyslowski; Rainer Dudek (Microelectron. Reliab., 2008)

Guest Editorial: 2007 EuroSimE conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. - Artur Wymyslowski (Microelectron. Reliab., 2008)

Guest Editorial: 2008 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. - Artur Wymyslowski (Microelectron. Reliab., 2009)

Guest Editorial: 2009 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. - Artur Wymyslowski (Microelectron. Reliab., 2010)

Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methods. - Lukasz Dowhan; Artur Wymyslowski; Pawel Janus; Magdalena Ekwinska; Olaf Wittler (Microelectron. Reliab., 2011)

Numerical prototyping methods in microsystem accelerometers design. - Lukasz Dowhan; Artur Wymyslowski; Stanislaw Kalicinski; Pawel Janus (Microelectron. Reliab., 2011)

2010 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. - Artur Wymyslowski (Microelectron. Reliab., 2011)

A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging. - E. R. Weltevreden; S. J. Tesarski; Artur Wymyslowski; Müge Erinc; Alexander W. J. Gielen (Microelectron. Reliab., 2012)

2011 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. - Artur Wymyslowski (Microelectron. Reliab., 2012)

Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique. - Didier Chicot; K. Tilkin; K. Jankowski; Artur Wymyslowski (Microelectron. Reliab., 2013)

Guest Editorial: 2012 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. - Artur Wymyslowski (Microelectron. Reliab., 2013)

Application of nanoindentation technique for investigation of elasto-plastic properties of the selected thin film materials. - Artur Wymyslowski; Lukasz Dowhan (Microelectron. Reliab., 2013)

Improving co-design of smart sensor front-ends. - Ryszard Swierczynski; Krzysztof Urbanski; Artur Wymyslowski (MIXDES, 2014)

Guest Editorial: 2013 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. - Artur Wymyslowski (Microelectron. Reliab., 2014)

Adhesion work analysis through molecular modeling and wetting angle measurement. - Dawid Jan Król; Artur Wymyslowski; Kamil Nouri Allaf (Microelectron. Reliab., 2015)

Guest Editorial: 2014 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. - Artur Wymyslowski (Microelectron. Reliab., 2015)

Guest Editorial: 2015 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. - Artur Wymyslowski (Microelectron. Reliab., 2016)

Guest Editorial: 2016 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. - Artur Wymyslowski (Microelectron. Reliab., 2017)