Compact thermal modeling for package design with practical power maps. - Zao Liu; Sheldon X.-D. Tan; Hai Wang 002; Rafael Quintanilla; Ashish Gupta 007 (IGCC, 2011)

Full-chip runtime error-tolerant thermal estimation and prediction for practical thermal management. - Hai Wang 002; Sheldon X.-D. Tan; Guangdeng Liao; Rafael Quintanilla; Ashish Gupta 007 (ICCAD, 2011)

Runtime power estimator calibration for high-performance microprocessors. - Hai Wang 002; Sheldon X.-D. Tan; Xuexin Liu; Ashish Gupta 007 (DATE, 2012)

Compact nonlinear thermal modeling of packaged integrated systems. - Zao Liu; Sheldon X.-D. Tan; Hai Wang 002; Sahana Swarup; Ashish Gupta 007 (ASP-DAC, 2013)

Composable thermal modeling and simulation for architecture-level thermal designs of multicore microprocessors. - Hai Wang 002; Sheldon X.-D. Tan; Duo Li; Ashish Gupta 007; Yuan Yuan 030 (ACM Trans. Design Autom. Electr. Syst., 2013)

Compact thermal modeling for packaged microprocessor design with practical power maps. - Zao Liu; Sheldon X.-D. Tan; Hai Wang 002; Yingbo Hua; Ashish Gupta 007 (Integr., 2014)