DfT architecture and ATPG for Interconnect tests of JEDEC Wide-I/O memory-on-logic die stacks. - Sergej Deutsch; Brion L. Keller; Vivek Chickermane; Subhasish Mukherjee; Navdeep Sood; Sandeep Kumar Goel; Ji-Jan Chen; Ashok Mehta; Frank Lee 004; Erik Jan Marinissen (ITC, 2012)

Test and debug strategy for TSMC CoWoS™ stacking process based heterogeneous 3D IC: A silicon case study. - Sandeep Kumar Goel; Saman Adham; Min-Jer Wang; Ji-Jan Chen; Tze-Chiang Huang; Ashok Mehta; Frank Lee 004; Vivek Chickermane; Brion L. Keller; Thomas Valind; Subhasish Mukherjee; Navdeep Sood; et al. (ITC, 2013)

Design-for-diagnosis: Your safety net in catching design errors in known good dies in CoWoSTM/3D ICs. - Sandeep Kumar Goel; Min-Jer Wang; Saman Adham; Ashok Mehta; Frank Lee 004 (VLSI-DAT, 2014)

A 1 Tbit/s Bandwidth 1024 b PLL/DLL-Less eDRAM PHY Using 0.3 V 0.105 mW/Gbps Low-Swing IO for CoWoS Application. - Mu-Shan Lin; Chien-Chun Tsai; Chih-Hsien Chang; Wen-Hung Huang; Ying-Yu Hsu; Shu-Chun Yang; Chin-Ming Fu; Mao-Hsuan Chou; Tien-Chien Huang; Ching-Fang Chen; Tze-Chiang Huang; Saman Adham; et al. (IEEE J. Solid State Circuits, 2014)