Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding. - Asisa Kumar Panigrahi; Satish Bonam; Tamal Ghosh; Siva Rama Krishna Vanjari; Shiv Govind Singh (3DIC, 2015)

Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC. - Kumail Khurram; Asisa Kumar Panigrahi; Satish Bonam; Om Krishan Singh; Shiv Govind Singh (3DIC, 2016)

Noise performance improvement through optimized stacked layer of liner structure around the TSV in 3D IC. - C. Hemanth Kumar; Asisa Kumar Panigrahi; Om Krishan Singh; Shiv Govind Singh (3DIC, 2016)

Low temperature CMOS compatible Cu-Cu thermo-compression bonding with constantan alloy passivation for 3D IC integration. - Asisa Kumar Panigrahi; Satish Bonam; Tamal Ghosh; Siva Rama Krishna Vanjari; Shiv Govind Singh (3DIC, 2016)

Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration. - Suraj Patil; Asisa Kumar Panigrahi; Satish Bonam; C. Hemanth Kumar; Om Krishan Singh; Shiv Govind Singh (3DIC, 2016)

Analysis of graphene and CNT based finned TTSV and spreaders for thermal management in 3D IC. - Suraj Singh; Asisa Kumar Panigrahi; Om Krishan Singh; Shiv Govind Singh (3DIC, 2016)

TCAD Simulation of a 10nm n-Channel Vertical Double Gate Silicon On Insulator MOSFET for Digital Applications. - Srinivas Varma; Ch Pratyusha Chowdari; D. Jayanthi; Asisa Kumar Panigrahi; K. Jamal (ICCCNT, 2022)