Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages. - Asit Kumar Gain; Y. C. Chan; Ahmed Sharif; N. B. Wong; Winco K. C. Yung (Microelectron. Reliab., 2009)

Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy. - Mansur Ahmed; Tama Fouzder; Ahmed Sharif; Asit Kumar Gain; Y. C. Chan (Microelectron. Reliab., 2010)

Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads. - Tama Fouzder; Asit Kumar Gain; Y. C. Chan; Ahmed Sharif; Winco K. C. Yung (Microelectron. Reliab., 2010)

Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO2 composite solder on flexible ball grid array substrates. - Asit Kumar Gain; Y. C. Chan; Winco K. C. Yung (Microelectron. Reliab., 2011)

Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads. - Asit Kumar Gain; Y. C. Chan; Winco K. C. Yung (Microelectron. Reliab., 2011)

Growth mechanism of intermetallic compounds and damping properties of Sn-Ag-Cu-1 wt% nano-ZrO2 composite solders. - Asit Kumar Gain; Y. C. Chan (Microelectron. Reliab., 2014)

High-temperature and humidity change the microstructure and degrade the material properties of tin‑silver interconnect material. - Asit Kumar Gain; Liangchi Zhang (Microelectron. Reliab., 2018)

Growth nature of in-situ Cu6Sn5-phase and their influence on creep and damping characteristics of Sn-Cu material under high-temperature and humidity. - Asit Kumar Gain; Liangchi Zhang (Microelectron. Reliab., 2018)