High-Frequency and Integrated Design Based on Flip-Chip Interconnection Technique (Hi-FIT) for High-Speed (>100 Gbaud) Optical Devices. - Shigeru Kanazawa; Hiroshi Yamazaki; Yuta Ueda; Wataru Kobayashi; Yoshihiro Ogiso; Johsuke Ozaki; Takahiko Shindo; Satoshi Tsunashima; Hiromasa Tanobe; Atsushi Araratake (IEICE Trans. Electron., 2019)