4.9 A 1ms high-speed vision chip with 3D-stacked 140GOPS column-parallel PEs for spatio-temporal image processing. - Tomohiro Yamazaki; Hironobu Katayama; Shuji Uehara; Atsushi Nose; Masatsugu Kobayashi; Sayaka Shida; Masaki Odahara; Kenichi Takamiya; Yasuaki Hisamatsu; Shizunori Matsumoto; Leo Miyashita; Yoshihiro Watanabe; et al. (ISSCC, 2017)

320 × 240 Back-Illuminated 10-µm CAPD Pixels for High-Speed Modulation Time-of-Flight CMOS Image Sensor. - Yuichi Kato; Takuya Sano; Yusuke Moriyama; Shunji Maeda; Takeshi Yamazaki; Atsushi Nose; Kimiyasu Shiina; Yohtaro Yasu; Ward van der Tempel; Alper Ercan; Yoshiki Ebiko; Daniel Van Nieuwenhove; et al. (IEEE J. Solid State Circuits, 2018)

Design and Performance of a 1 ms High-Speed Vision Chip with 3D-Stacked 140 GOPS Column-Parallel PEs. - Atsushi Nose; Tomohiro Yamazaki; Hironobu Katayama; Shuji Uehara; Masatsugu Kobayashi; Sayaka Shida; Masaki Odahara; Kenichi Takamiya; Shizunori Matsumoto; Leo Miyashita; Yoshihiro Watanabe; Takashi Izawa; et al. (Sensors, 2018)

216 fps 672 × 512 pixel 3 μm Indirect Time-of-Flight Image Sensor with 1-Frame Depth Acquisition for Motion Artifact Suppression. - Chihiro Okada; Sozo Yokogawa; Yuhi Yorikado; Katsumi Honda; Naoki Okuno; Ryohei Ikeno; Makoto Yamakoshi; Hiroshi Ito; Shohei Yoshitsune; Masatsugu Desaki; Shota Hida; Atsushi Nose; et al. (VLSI Technology and Circuits, 2023)