Reliability of 80 mum pitch flip chip attachment on flex. - Petteri Palm; Jarmo Määttänen; Aulis Tuominen; Eero Ristolainen (Microelectron. Reliab., 2001)

The effect of sputtered interface metallic layers on reinforced core laminate making build-up structures. - Paavo Jalonen; Aulis Tuominen (Microelectron. Reliab., 2002)

Decreasing variation in paste printing using statistical process control. - Timo Liukkonen; Aulis Tuominen (Microelectron. Reliab., 2003)

Metallization of microvias by sputter-deposition. - Teija Uusluoto; Paavo Jalonen; Harri Laaksonen; Aulis Tuominen (Microelectron. Reliab., 2004)

Characterization of resolution cycle times of corrective actions in mobile terminals. - Anderson Mwegerano; Pekka Kytösaho; Timo Liukkonen; Aulis Tuominen (Qual. Reliab. Eng. Int., 2008)

Thermal analysis of LED spot lighting device operating in external natural or forced heat convection. - Mika Maaspuro; Aulis Tuominen (Microelectron. Reliab., 2013)