A successful implementation of dual damascene architecture to copper TSV for 3D high density applications. - Rebha El Farhane; Myriam Assous; Patrick Leduc; Aurélie Thuaire; David Bouchu; Hélène Feldis; Nicolas Sillon (3DIC, 2010)

Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric. - Thomas Frank; Stéphane Moreau; Cédrick Chappaz; Patrick Leduc; Lucile Arnaud; Aurélie Thuaire; Emmanuel Chery; F. Lorut; Lorena Anghel; Gilles Poupon (Microelectron. Reliab., 2013)