Bounding relations for natural convection heat transfer from vertical printed circuit boards. - Avram Bar-Cohen (Proc. IEEE, 1985)

Direct Liquid Cooling of High Flux Micro and Nano Electronic Components. - Avram Bar-Cohen; Mehmet Arik; M. Ohadi (Proc. IEEE, 2006)

Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs. - Bing Shi 001; Ankur Srivastava 001; Avram Bar-Cohen (ISVLSI, 2012)

Life prediction of LED-based recess downlight cooled by synthetic jet. - Bong-Min Song; Bongtae Han; Avram Bar-Cohen; Mehmet Arik; Rajdeep Sharma; Stan Weaver (Microelectron. Reliab., 2012)

Co-design of micro-fluidic heat sink and thermal through-silicon-vias for cooling of three-dimensional integrated circuit. - Bing Shi 001; Ankur Srivastava 001; Avram Bar-Cohen (IET Circuits Devices Syst., 2013)

Unlocking the True Potential of 3-D CPUs With Microfluidic Cooling. - Caleb Serafy; Avram Bar-Cohen; Ankur Srivastava 001; Donald Yeung (IEEE Trans. Very Large Scale Integr. Syst., 2016)