Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects. - Aymen Moujbani; Jörg Kludt; Kirsten Weide-Zaage; Markus Ackermann 002; Verena Hein; Lutz Meinshausen (Microelectron. Reliab., 2013)

Simulation in 3D integration and TSV. - Kirsten Weide-Zaage; Aymen Moujbani; Jörg Kludt (LASCAS, 2014)