The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition. - Mohd Khairuddin Md Arshad; Ibrahim Ahmad; Azman Jalar; Ghazali Omar (Microelectron. Reliab., 2006)

Effect of wafer thinning methods towards fracture strength and topography of silicon die. - Hoh Huey Jiun; Ibrahim Ahmad; Azman Jalar; Ghazali Omar (Microelectron. Reliab., 2006)

Characterization of parasitic residual deposition on passivation layer in electroless nickel immersion gold process. - Mohd Khairuddin Md Arshad; Azman Jalar; Ibrahim Ahmad (Microelectron. Reliab., 2007)

High Sensitivity pH Sensor Based on Porous Silicon (PSi) Extended Gate Field-Effect Transistor. - Naif H. Al-Hardan; Muhammad Azmi Abdul Hamid; Naser M. Ahmed; Azman Jalar; Roslinda Shamsudin; Norinsan Kamil Othman; Lim Kar Keng; Weesiong Chiu; Hamzah N. Al-Rawi (Sensors, 2016)

Effect of Ultrasonic Process Parameter on Resistance and Plastic Deformation of the Aluminum Ribbon Bond on Molybdenum Layer. - Sabarina Abdul Hamid; Muhammad Nubli Zulkifli; Azman Jalar; Maria Abu Bakar; Wan Nursheila Wan Jusoh; Hassan Basher; Michael Daenen (TENCON, 2023)