The effect of model building on the accuracy of fatigue life predictions in electronic packages. - P. Towashiraporn; G. Subbarayan; B. McIlvanie; B. C. Hunter; D. Love; B. Sullivan (Microelectron. Reliab., 2004)

Response surface models for efficient, modular estimation of solder joint reliability in area array packages. - L. Zhang; G. Subbarayan; B. C. Hunter; D. Rose (Microelectron. Reliab., 2005)