Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling. - Bart Vandevelde; Andrej Ivankovic; B. Debecker; Melina Lofrano; Kris Vanstreels; Wei Guo; Vladimir Cherman; Marcel Gonzalez; Geert Van der Plas; Ingrid De Wolf; Eric Beyne; Zsolt Tokei (Microelectron. Reliab., 2014)