Thermal behavior of self-heating effect in FinFET devices acting on back-end interconnects. - C. W. Chang; S. E. Liu; B. L. Lin; C. C. Chiu; Y.-H. Lee; K. Wu (IRPS, 2015)

Study of a new electromigration failure mechanism by novel test structure. - L. D. Chen; B. L. Lin; M.-H. Hsieh; C. W. Chang; J. S. Tsai; J. C. Peng; C. C. Chiu; Y.-H. Lee (IRPS, 2015)