Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages. - Y. P. Wu; M. O. Alam; Yan Cheong Chan; B. Y. Wu (Microelectron. Reliab., 2004)

Application Research of GA in Parametric and Variant Design. - Y. R. Zhong; B. Y. Wu; J. Peng (WGEC, 2009)

A new algorithm for a class of linear nonlocal boundary value problems based on the reproducing kernel method. - B. Y. Wu; X. Y. Li (Appl. Math. Lett., 2011)

Periodic boundary value problems for neutral multi-pantograph equations. - X. Y. Li; B. Y. Wu (Comput. Math. Appl., 2011)

A novel method for nonlinear singular fourth order four-point boundary value problems. - X. Y. Li; B. Y. Wu (Comput. Math. Appl., 2011)

Error estimation for the reproducing kernel method to solve linear boundary value problems. - X. Y. Li; B. Y. Wu (J. Comput. Appl. Math., 2013)

A novel soldering method to evaluate PCB pad cratering for pin-pull testing. - Miao Cai; D. J. Xie; W. B. Chen; B. Y. Wu; Dao-Guo Yang; G. Q. Zhang (Microelectron. Reliab., 2013)

A numerical method for solving distributed order diffusion equations. - X. Y. Li; B. Y. Wu (Appl. Math. Lett., 2016)

Iterative reproducing kernel method for nonlinear variable-order space fractional diffusion equations. - X. Y. Li; B. Y. Wu (Int. J. Comput. Math., 2018)

Mittag-Leffler kernel-based oversampling collocation method for fractional initial value problems with contaminated data. - X. Y. Li; B. Y. Wu; X. Y. Liu (Appl. Math. Lett., 2024)

Fast and highly accurate reproducing kernels based approach for Poisson equation. - X. Y. Li; B. Y. Wu (Appl. Math. Lett., 2025)