Copper Wire Bonding, Preeti S., Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G. Pecht, Springer (2014). XXVI, pp 235, ISBN: 978-1-4614-5760-2 (Print), 978-1-4614-5761-9 (Online). - Chong Leong Gan; Classe Francis; Bak Lee Chan; Uda Hashim (Microelectron. Reliab., 2014)