Microscopic stress simulation of non-planar chip technologies. - Javad Zarbakhsh; Balamurugan Karunamurthy; Carlos O. Trejo-Caballero; Endre Barti; Thomas Detzel (Microelectron. Reliab., 2010)

A novel simulation methodology for full chip-package thermo-mechanical reliability investigations. - Balamurugan Karunamurthy; Thomas Ostermann; Monojit Bhattacharya; Sandipan Maity (Microelectron. J., 2014)