Thermal simulation of UV laser ablation of polyimide. - Péter Gordon; Bálint Balogh; Bálint Sinkovics (Microelectron. Reliab., 2007)

Board level investigation of BGA solder joint deformation strength. - Bálint Sinkovics; Olivér Krammer (Microelectron. Reliab., 2009)

Improved method for determining the shear strength of chip component solder joints. - Olivér Krammer; Bálint Sinkovics (Microelectron. Reliab., 2010)