Investigation of the characteristics of overhang bonding for 3-D stacked dies in microelectronics packaging. - Junhui Li; Luhua Deng; Bangke Ma; Ling gang Liu; Fuliang Wang; Lei Han (Microelectron. Reliab., 2011)

Study on a cooling system based on thermoelectric cooler for thermal management of high-power LEDs. - Junhui Li; Bangke Ma; Ruishan Wang; Lei Han (Microelectron. Reliab., 2011)