3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly. - Alberto Fazzi; Luca Magagni; Mauro Mirandola; Barbara Charlet; Léa Di Cioccio; Erik Jung; Roberto Canegallo; Roberto Guerrieri (IEEE J. Solid State Circuits, 2007)

System on Wafer: A New Silicon Concept in SiP. - Gilles Poupon; Nicolas Sillon; David Henry; Charlotte Gillot; Alan Mathewson; Léa Di Cioccio; Barbara Charlet; Patrick Leduc; Maud Vinet; Perrine Batude (Proc. IEEE, 2009)