Influence of copper diffusion on the shape of whiskers grown on bright tin layers. - Barbara Horváth (Microelectron. Reliab., 2013)

Whiskering behaviour of immersion tin surface coating. - Balázs Illés; Barbara Horváth (Microelectron. Reliab., 2013)

Fast filling of through-silicon via (TSV) with conductive polymer/metal composites. - Jin Kawakita; Barbara Horváth; Toyohiro Chikyow (3DIC, 2015)