Modeling and characterization of long on-chip interconnections for high-performance microprocessors. - Alina Deutsch; Gerard V. Kopcsay; Christopher W. Surovic; Barry J. Rubin; Lewis M. Terman; Richard P. Dunne Jr.; Thomas A. Gallo; Robert H. Dennard (IBM J. Res. Dev., 1995)

A comprehensive 2-D inductance modeling approach for VLSI interconnects: frequency-dependent extraction and compact circuit model synthesis. - Gerard V. Kopcsay; Byron Krauter; David Widiger; Alina Deutsch; Barry J. Rubin; Howard H. Smith (IEEE Trans. Very Large Scale Integr. Syst., 2002)

IBM Intelligent Bricks project - Petabytes and beyond. - Winfried W. Wilcke; Robert B. Garner; Claudio Fleiner; Richard F. Freitas; Richard A. Golding; Joseph S. Glider; Deepak R. Kenchammana-Hosekote; James Lee Hafner; K. Moidin Mohiuddin; K. K. Rao; Ralph A. Becker-Szendy; Theodore M. Wong; et al. (IBM J. Res. Dev., 2006)

Electrical-thermal co-analysis for power delivery networks in 3D system integration. - Jianyong Xie; Daehyun Chung; Madhavan Swaminathan; Michael McAllister; Alina Deutsch; Lijun Jiang; Barry J. Rubin (3DIC, 2009)

Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies. - Chuan Xu; Lijun Jiang; Seshadri K. Kolluri; Barry J. Rubin; Alina Deutsch; Howard H. Smith; Kaustav Banerjee (ICCAD, 2009)