Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads. - Petar Ratchev; Serguei Stoukatch; Bart Swinnen (Microelectron. Reliab., 2006)

Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures. - Yu Yang; Hugo Bender; Kai Arstila; Bart Swinnen; Bert Verlinden; Ingrid De Wolf (Microelectron. Reliab., 2008)

3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV). - Jan Van Olmen; Jan Coenen; Wim Dehaene; Kristin De Meyer; Cedric Huyghebaert; Anne Jourdain; Guruprasad Katti; Abdelkarim Mercha; Michal Rakowski; Michele Stucchi; Youssef Travaly; Eric Beyne; et al. (3DIC, 2009)

Impact of 3D design choices on manufacturing cost. - Dimitrios Velenis; Michele Stucchi; Erik Jan Marinissen; Bart Swinnen; Eric Beyne (3DIC, 2009)

3-D Technology Assessment: Path-Finding the Technology/Design Sweet-Spot. - Paul Marchal; Bruno Bougard; Guruprasad Katti; Michele Stucchi; Wim Dehaene; Antonis Papanikolaou; Diederik Verkest; Bart Swinnen; Eric Beyne (Proc. IEEE, 2009)

300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications. - Anne Jourdain; Thibault Buisson; Alain Phommahaxay; Mark Privett; Dan Wallace; Sumant Sood; Peter Bisson; Eric Beyne; Youssef Travaly; Bart Swinnen (3DIC, 2010)

In-line metrology and inspection for process control during 3D stacking of IC's. - Sandip Halder; Ingrid De Wolf; Alain Phommahaxay; Andy Miller; Mireille Maenhoudt; Gerald Beyer; Bart Swinnen; Eric Beyne (3DIC, 2011)

Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding. - Alain Phommahaxay; Anne Jourdain; Greet Verbinnen; Tobias Woitke; Peter Bisson; Markus Gabriel; Walter Spiess; Alice Guerrero; Jeremy McCutcheon; Rama Puligadda; Pieter Bex; Axel Van den Eede; et al. (3DIC, 2011)

3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. - Wei Guo; Geert Van der Plas; Andrej Ivankovic; Geert Eneman; Vladimir Cherman; Bart De Wachter; Abdelkarim Mercha; Mario Gonzalez; Yann Civale; Augusto Redolfi; Thibault Buisson; A. Jourdan; et al. (ICICDT, 2012)