New Method to Perform TDDB Tests for Hybrid Bonding Interconnects. - Bassel Ayoub; Stéphane Moreau; S. Lhostis; P. Lamontagne; H. Combeau; J. G. Mattei; Hélène Frémont (IRPS, 2022)

Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits. - Stéphane Moreau; David Bouchu; J. Jourdon; Bassel Ayoub; S. Lhostis; Hélène Frémont; P. Lamontagne (IRPS, 2023)