Ultra-Thin-Body and Buried Oxide FD-SOI next generation nodes and eNVM technologies for advanced IC design. - Claire Fenouillet-Béranger; Laurent Fesquet; Rihab Chouk; Gabriel Pares; Baudoin Martineau; Marie Claire Cyrille; Thierry Poiroux; Olivier Billoint; Dominique Noguet (DDECS, 2025)