Power neutral performance scaling for energy harvesting MP-SoCs. - Benjamin J. Fletcher; Domenico Balsamo; Geoff V. Merrett (DATE, 2017)

A high-speed design methodology for inductive coupling links in 3D-ICs. - Benjamin J. Fletcher; Shidhartha Das; Terrence S. T. Mak (DATE, 2018)

Low-power 3D integration using inductive coupling links for neurotechnology applications. - Benjamin J. Fletcher; Shidhartha Das; Chi-Sang Poon; Terrence S. T. Mak (DATE, 2018)

Globally Wireless Locally Wired (GloWiLoW): A Clock Distribution Network for Many-Core Systems. - Qian Ding; Benjamin J. Fletcher; Terrence S. T. Mak (ISCAS, 2018)

CoDAPT: A Concurrent Data And Power Transceiver for Fully Wireless 3D-ICs. - Benjamin J. Fletcher; Shidhartha Das; Terrence S. T. Mak (DATE, 2019)

A 10.8pJ/bit Pulse-Position Inductive Transceiver for Low-Energy Wireless 3D Integration. - Benjamin J. Fletcher; Terrence S. T. Mak; Shidhartha Das (ESSCIRC, 2019)

A Low-Energy Inductive Transceiver using Spike-Latency Encoding for Wireless 3D Integration. - Benjamin J. Fletcher; Shidhartha Das; Terrence S. T. Mak (ISLPED, 2019)

Momentum: Power-neutral Performance Scaling with Intrinsic MPPT for Energy Harvesting Computing Systems. - Domenico Balsamo; Benjamin J. Fletcher; Alex S. Weddell; Giorgos Karatziolas; Bashir M. Al-Hashimi; Geoff V. Merrett (ACM Trans. Embed. Comput. Syst., 2019)

Design and Optimization of Inductive-Coupling Links for 3-D-ICs. - Benjamin J. Fletcher; Shidhartha Das; Terrence S. T. Mak (IEEE Trans. Very Large Scale Integr. Syst., 2019)

A 3D-Stacked Cortex-M0 SoC with 20.3Gbps/mm2 7.1mW/mm2 Simultaneous Wireless Inter-Tier Data and Power Transfer. - Benjamin J. Fletcher; Terrence S. T. Mak; Shidhartha Das (VLSI Circuits, 2020)

A Spike-Latency Transceiver With Tunable Pulse Control for Low-Energy Wireless 3-D Integration. - Benjamin J. Fletcher; Shidhartha Das; Terrence S. T. Mak (IEEE J. Solid State Circuits, 2020)