Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations. - Jean-Yves Delétage; F. J.-M. Verdier; Bernard Plano; Yannick Deshayes; Laurent Béchou; Yves Danto (Microelectron. Reliab., 2003)

Failure Analysis-assisted FMEA. - G. Cassanelli; Giovanna Mura; Fausto Fantini; Massimo Vanzi; Bernard Plano (Microelectron. Reliab., 2006)

Pushing toward the limits of acceleration: Example on wire-bond assemblies. - Jean-Baptiste Jullien; Bernard Plano; Hélène Frémont (Microelectron. Reliab., 2012)

Association of a Love wave sensor to thin film molecularly imprinted polymers for nucleosides analogs detection. - Naima Lebal; Hamida Hallil; Corinne Dejous; Bernard Plano; A. Krstulja; Raphaël Delépée; Dominique Rebière; Luigi A. Agrofoglio (NEMS, 2013)

Electro- and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads. - Lutz Meinshausen; Hélène Frémont; Kirsten Weide-Zaage; Bernard Plano (Microelectron. Reliab., 2013)

Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps. - Lutz Meinshausen; Hélène Frémont; Kirsten Weide-Zaage; Bernard Plano (Microelectron. Reliab., 2015)

Effects of salt spray test on lead-free solder alloy. - Alexandrine Guédon-Gracia; Hélène Frémont; Bernard Plano; Jean-Yves Delétage; Kirsten Weide-Zaage (Microelectron. Reliab., 2016)

Love Acoustic Wave-Based Devices and Molecularly-Imprinted Polymers as Versatile Sensors for Electronic Nose or Tongue for Cancer Monitoring. - Corinne Dejous; Hamida Hallil; Vincent Raimbault; Jean-Luc Lachaud; Bernard Plano; Raphaël Delépée; Patrick Favetta; Luigi A. Agrofoglio; Dominique Rebière (Sensors, 2016)