Mechanical Reliability of MEMS-structures under shock load. - Ulrich Wagner; J. Franz; M. Schweiker; Winfried Bernhard; Roland Müller-Fiedler; Bernd Michel; Oliver Paul (Microelectron. Reliab., 2001)

Parametric FE-approach to flip-chip reliability under various loading conditions. - Bernhard Wunderle; Wolfgang Nüchter; Andreas Schubert; Bernd Michel; Herbert Reichl (Microelectron. Reliab., 2004)

Progress in reliability research in the micro and nano region. - Bernhard Wunderle; Bernd Michel (Microelectron. Reliab., 2006)

Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept. - Mike Roellig; Rainer Dudek; Steffen Wiese; Bjoern Boehme; Bernhard Wunderle; Klaus-Jürgen Wolter; Bernd Michel (Microelectron. Reliab., 2007)

Reliability of SnPb and Pb-free flip-chips under different test conditions. - M. Spraul; Wolfgang Nüchter; A. Möller; Bernhard Wunderle; Bernd Michel (Microelectron. Reliab., 2007)

Simulation based analysis of secondary effects on solder fatigue. - Rainer Dudek; Ralf Döring; Christine Bombach; Bernd Michel (Microelectron. Reliab., 2009)

Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling. - Bernhard Wunderle; E. Dermitzaki; O. Hölck; Jörg Bauer 002; Hans Walter; Q. Shaik; K. Rätzke; Franz Faupel; Bernd Michel; Herbert Reichl (Microelectron. Reliab., 2010)

Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling. - O. Hölck; E. Dermitzaki; Bernhard Wunderle; Jörg Bauer 002; Bernd Michel (Microelectron. Reliab., 2011)

Studies on the reliability of power packages based on strength and fracture criteria. - Rainer Dudek; Reinhard Pufall; Bettina Seiler; Bernd Michel (Microelectron. Reliab., 2012)

Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination. - O. Hölck; Jörg Bauer 002; Olaf Wittler; Bernd Michel; Bernhard Wunderle (Microelectron. Reliab., 2012)

Effect of moisture swelling on MEMS packaging and integrated sensors. - J. Keller; Raul Mrossko; H. Dobrinski; J. Stürmann; Ralf Döring; Rainer Dudek; Sven Rzepka; Bernd Michel (Microelectron. Reliab., 2013)

On the crack and delamination risk optimization of a Si-interposer for LED packaging. - Jürgen Auersperg; Rainer Dudek; R. Jordan; O. Bochow-Neß; Sven Rzepka; Bernd Michel (Microelectron. Reliab., 2014)

Stress impact of moisture diffusion measured with the stress chip. - Florian Schindler-Saefkow; Florian Rost; Alexander Otto; R. Pantou; Raul Mroßko; Bernhard Wunderle; Bernd Michel; Sven Rzepka; Jürgen Keller (Microelectron. Reliab., 2014)

Stress analyses of high spatial resolution on TSV and BEoL structures. - Dietmar Vogel; Ellen Auerswald; Jürgen Auersperg; Parisa Bayat; Raul D. Rodriguez; Dietrich R. T. Zahn; Sven Rzepka; Bernd Michel (Microelectron. Reliab., 2014)