A fast test technique for life time estimation of ultrasonically welded Cu-Cu interconnects. - Bernhard Czerny; Golta Khatibi; Brigitte Weiss; T. Licht (Microelectron. Reliab., 2010)

Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions. - Bernhard Czerny; Martin Lederer; Bernhard Nagl; Alexander Trnka; Golta Khatibi; Markus Thoben (Microelectron. Reliab., 2012)

Experimental and analytical study of geometry effects on the fatigue life of Al bond wire interconnects. - Bernhard Czerny; I. Paul; Golta Khatibi; Markus Thoben (Microelectron. Reliab., 2013)

Interface reliability and lifetime prediction of heavy aluminum wire bonds. - Bernhard Czerny; Golta Khatibi (Microelectron. Reliab., 2016)

Fatigue testing method for fine bond wires in an LQFP package. - Bernhard Czerny; Ali Mazloum-Nejadari; Golta Khatibi; Laurens Weiss; Michael Zehetbauer (Microelectron. Reliab., 2016)

Reliability of Cu wire bonds in microelectronic packages. - Ali Mazloum-Nejadari; Golta Khatibi; Bernhard Czerny; Martin Lederer; Johann Nicolics; L. Weiss (Microelectron. Reliab., 2017)

Wire bond degradation under thermo- and pure mechanical loading. - Kristian Bonderup Pedersen; Dennis A. Nielsen; Bernhard Czerny; Golta Khatibi; Francesco Iannuzzo; Vladimir N. Popok; Kjeld Pedersen (Microelectron. Reliab., 2017)

Cyclic robustness of heavy wire bonds: Al, AlMg, Cu and CucorAl. - Bernhard Czerny; Golta Khatibi (Microelectron. Reliab., 2018)