Transistor reliability characterization and modeling of the 22FFL FinFET technology. - Chen-Yi Su; M. Armstrong; Lei Jiang; S. A. Kumar; C. D. Landon; S. Liu; Inanc Meric; K. W. Park; Leif Paulson; K. Phoa; Bernhard Sell; Jihan Standfest; et al. (IRPS, 2018)

A 32A 5V-Input, 94.2% Peak Efficiency High-Frequency Power Converter Module Featuring Package-Integrated Low-Voltage GaN NMOS Power Transistors. - Nachiket V. Desai; Harish K. Krishnamurthy; William J. Lambert; Jingshu Yu; Han Wui Then; Nicolas Butzen; Sheldon Weng; Christopher Schaef; N. Nidhi; Marko Radosavljevic; Johann Rode; Justin Sandford; et al. (VLSI Circuits, 2021)

Intel 4 CMOS Technology Featuring Advanced FinFET Transistors optimized for High Density and High-Performance Computing. - Bernhard Sell; S. An; J. Armstrong; D. Bahr; B. Bains; Rohan Bambery; K. Bang; D. Basu; S. Bendapudi; D. Bergstrom; R. Bhandavat; S. Bhowmick; et al. (VLSI Technology and Circuits, 2022)

Intel PowerVia Technology: Backside Power Delivery for High Density and High-Performance Computing. - Walid M. Hafez; P. Agnihotri; M. Asoro; M. Aykol; B. Bains; Rohan Bambery; M. Bapna; A. Barik; A. Chatterjee; P. C. Chiu; T. Chu; C. Firby; et al. (VLSI Technology and Circuits, 2023)

E-Core Implementation in Intel 4 with PowerVia (Backside Power) Technology. - M. Shamanna; E. Abuayob; G. Aenuganti; C. Alvares; J. Antony; A. Bahudhanam; A. Chandran; P. Chew; A. Chatterjee; B. Chauhan; N. Dandeti; J. Desai; et al. (VLSI Technology and Circuits, 2023)

An Intel 3 Advanced FinFET Platform Technology for High Performance Computing and SOC Product Applications. - Walid M. Hafez; D. Abanulo; M. Abdelkader; S. An; C. Auth; D. Bahr; V. Balakrishnan; Rohan Bambery; M. Beck; M. Bhargava; S. Bhowmick; J. Biggs-houck; et al. (VLSI Technology and Circuits, 2024)

Integration of Si-Interposer and High Density MIM Capacitor on 2.5D Foveros Face-to-Face Architecture. - Christopher Pelto; R. Aggarwal; R. Ahan; M. Armstrong; M. Bebek; M. Blount; S. Chowdhury; J. Chuah; C. Connor; T. DeBonis; B. Dhayal; A. Dougless; et al. (VLSI Technology and Circuits, 2024)