Studies on the reliability of power packages based on strength and fracture criteria. - Rainer Dudek; Reinhard Pufall; Bettina Seiler; Bernd Michel (Microelectron. Reliab., 2012)

Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue. - Rainer Dudek; M. Hildebrand; Sven Rzepka; T. Fries; Ralf Döring; Bettina Seiler; R. W. Ortmann (Microelectron. Reliab., 2018)