Reliability Characterization of a Flexible Interconnect for Cryogenic and Quantum Applications. - Emma R. Schmidgall; Flavio Griggio; George H. Thiel; Sherman E. Peek; Bhargav Yelamanchili; Archit Shah; Vaibhav Gupta; John A. Sellers; Michael C. Hamilton; David B. Tuckerman; Samuel d'Hollosy (IRPS, 2021)